Analysis of the FEK Delvotec 6400 Wedge Bonding System

Abstract

Modern production of microelectronics and hybrid electronic modules is characterized by high requirements for the accuracy of interconnection formation, stability of technological parameters, and reliability of electrical contacts. Among the key factors influencing the quality of the wedge bonding process are the positioning accuracy of the bonding tool and the stability of ultrasonic impact during the formation of the bonded contact. The use of the FEK Delvotec 6400 system makes it possible to implement high-precision control of the tool trajectory, monitoring of ultrasonic energy parameters, and automation of the wire bonding technological process. In this regard, an important task is the analysis of the positioning system and ultrasonic impact in the wedge bonding process in order to improve the quality of interconnections and the efficiency of electronic module manufacturing.