Analysis of the Technological Process of Wedge Bonding Using FEK Delvotec 6400 in Microelectronics

Abstract

Modern development of microelectronics, power electronics, and hybrid electronic modules is characterized by the continuous reduction of component geometric dimensions, increased packaging density, and growing requirements for the reliability of interconnections. One of the key stages in the production of microelectronic devices is the process of forming electrical contacts between the semiconductor die, substrate, and package leads. To implement these tasks, wedge bonding technology using thin aluminum wire is widely applied, as it provides high positioning accuracy, stability of electrical parameters, and reliable connections during long-term operation of electronic modules. This technology is especially relevant in the production of hybrid integrated circuits, sensor systems, power modules, and specialized radio-electronic equipment