Structural diagram of automated quality control process of silicon wafers during their surface shaping

Публікація:
Structural diagram of automated quality control process of silicon wafers during their surface shaping

dc.contributor.author	Nevlyudov, I.
dc.contributor.author	Botsman, I.
dc.contributor.author	Tesliuk, S.
dc.date.accessioned	2021-03-02T13:09:32Z
dc.date.available	2021-03-02T13:09:32Z
dc.date.issued	2021
dc.identifier.citation	Nevlyudov I., Botsman I., Tesliuk S. Structural diagram of automated quality control process of silicon wafers during their surface shaping / I. Nevlyudov, I. Botsman, S. Tesliuk // Theoretical and scientific bases of development of scientific thought : abstracts of V International Scientific and Practical Conference, Rome, Italy, February 16-19, 2021. – Rome : International Science Group. – 2021. – Р. 612–615.	uk_UA
dc.identifier.isbn	978-1-63684-356-8
dc.identifier.uri	http://openarchive.nure.ua/handle/document/14755
dc.language.iso	en	uk_UA
dc.publisher	International Science Group	uk_UA
dc.subject	silicon wafer	uk_UA
dc.subject	control process	uk_UA
dc.subject	surface shaping	uk_UA
dc.subject	quality control	uk_UA
dc.title	Structural diagram of automated quality control process of silicon wafers during their surface shaping	uk_UA
dc.type	Conference proceedings	uk_UA
dspace.entity.type	Publication