Публікація:
Modeling of the Thermal Mode of Heating the Working Area of the Automated Banknote Wrapper

dc.contributor.authorYevsieiev, V.
dc.contributor.authorUskov, S.
dc.date.accessioned2024-07-24T12:38:37Z
dc.date.available2024-07-24T12:38:37Z
dc.date.issued2024
dc.description.abstractThe relevance of research related to the modeling of the thermal mode of heating the working area of an automated banknote packer is due to several key factors. First, the banknote packaging process requires high precision and reliability to ensure the safety and security of securities. Heating of the working area can affect the quality of packaging, causing deformation of materials or even damage to banknotes, which requires a detailed analysis of thermal regimes. Secondly, the automation of the banknote packaging process involves the use of complex mechanisms and electronics, which can also be sensitive to temperature changes. The development of optimal thermal regimes allows to increase the reliability and durability of these systems, reducing the risk of failure due to overheating or uneven heat distribution. Thirdly, given the high value and sensitivity of banknotes, it is important to ensure the stability and controllability of their storage and processing conditions. Modeling thermal regimes helps predict and prevent possible problems related to thermal effects, as well as optimize the operating parameters of the automated packer to increase its efficiency. In addition, the research data have a significant impact on the economic efficiency of banking institutions and other organizations that handle large amounts of cash. Optimizing thermal regimes helps reduce equipment maintenance and repair costs, as well as reduces the likelihood of losses due to damage to banknotes.
dc.identifier.citationYevsieiev V. Modeling of the Thermal Mode of Heating the Working Area of the Automated Banknote Wrapper / V. Yevsieiev, S. Uskov // VII International Scientific and Theoretical Conference Formation of innovative potential of world science, 19.07.2024. – Tel Aviv, State of Israel, 2024. – P. 44-47.
dc.identifier.doi10.36074/scientia-19.07.2024
dc.identifier.urihttps://openarchive.nure.ua/handle/document/27521
dc.language.isoen_US
dc.publisherCollection of scientific papers «SCIENTIA»
dc.subjectbanknote packer
dc.subjectNX Nastran
dc.titleModeling of the Thermal Mode of Heating the Working Area of the Automated Banknote Wrapper
dc.typeThesis
dspace.entity.typePublication

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