Model of the Technological Process of Wedge Bonding Based on FEK Delvotec 6400 in the Production of Hybrid Electronic Modules

Abstract

Modern development of microelectronics and hybrid electronic modules is characterized by continuously increasing requirements for the accuracy, reliability, and stability of interconnections in the manufacturing process of electronic components. One of the most widely used technologies for forming electrical contacts is thin aluminum wire wedge bonding, which ensures high connection quality and the possibility of manufacturing process automation. The use of the FEK Delvotec 6400 system makes it possible to achieve high-precision tool positioning, control of technological parameters, and stability of the bonding process in the production of hybrid electronic modules. In this regard, an important task is the development of a model of the wedge bonding technological process, which will allow analyzing the influence of equipment operating modes on the quality of interconnections and improving the efficiency of the manufacturing process.