Comparative Analysis of Wedge Bonding Methods and Factors Affecting the Quality of Contact Interconnections in Microelectronics

Abstract

The paper presents a comparative analysis of wedge bonding methods used for forming contact interconnections in microelectronics and hybrid electronic modules, considering the principles of energy input, bonding configuration, wire materials, and technological conditions. The analysis identifies the main advantages and limitations of ultrasonic, thermosonic, thermal, and auxiliary-energy-assisted wedge bonding and establishes that contact quality is determined by the combined influence of ultrasonic energy, temperature, bonding force, bonding time, wire properties, contact surface condition, and joint geometry, providing a basis for further optimization and digital modeling of the bonding process.