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Публікація:
Basic technologies and techniques ML/AI for improving physical layer security for 5G/6G communications systems

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Дата

2023

Назва журналу

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Видавництво

Дослідницькі проекти

Організаційні підрозділи

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Анотація

One of the main features of using the millimeter wave band in the deployment of 5G/6G technologies is that these waves have a narrower range and less ability to penetrate obstacles such as buildings and trees [1,2]. Therefore, millimeter waves require a larger number of communication nodes located closer to each other to ensure network coverage. In addition, due to the high frequency of millimeter waves, they are subject to greater signal scattering and absorption from surfaces such as building walls and other obstacles, which can result in reduced data transmission range. Therefore, it is necessary to consider engineering solutions and technologies of artificial intelligence (IA) and machine learning (ML), which will allow ensuring high-quality communication between communication nodes, taking into account the peculiarities of the millimeter range of radio waves. However, thanks to the high bandwidth of the millimeter wave band, 5G/6G technology can provide high-speed transmission of large amounts of data, enabling new applications and services such as virtual reality (VR), augmented reality (AR), augmented reality (XR), Internet of Things (IoT) and others. Therefore, using the millimeter range of radio waves is an important element of 5G/6G technology that requires specific solutions to ensure reliability and security at the physical level of the network.

Опис

Ключові слова

Physical layer security, Future communication systems 5G/6G, Artificial intelligence, Machine learning

Бібліографічний опис

Tsopa O. Basic technologies and techniques ml/ai for improving physical layer security for 5g/6g communications systems / O. Tsopa, O. Dudka A. Merzlikin // System analysis and intelligent systems for management : The 17th International scientific and practical conference, Ankara, Turkey, 2-5 May 2023. – P. 403–408.

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