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Публікація Electromagnetic Compatibility Analysis of the Infocommunication Systems Components on the Flexible Structures Basis(2015) Zharikova, I. V.; Novoselov, S.; Nevlyudova, V.; Botsman, O.The design requirements analysis for the infocommunication systems components on the basis of flexible printed circuit boards taking into account their electromagnetic compatibility is performed in the article. The basic parasite parameters of multi-layered printed circuit boards are considered and the recommendations on their diminishing are formulated. Also the information of mechanical actions influence on the electromagnetic compatibility of electronic modules is presented.Публікація MEMS Intellect Multiprobes Contacting Devices for Electrical Checking-up of Multilayers Commutative Boards and BGA/CSP Electronic Components(KHARKOV NATIONAL UNIVERSITY OF RADIOELECTRONICS, 2012) Nevliudov, I. Sh.; Palagin, V. A.; Razumov-Frizjuk, E. A.; Zharikova, I. V.The aim of this paper is to introduce a new method of multilayer commutative boards (printed, thick or thin film) and BGA components testing. Four types of test fixtures for connecting some thousands test points on unit under test to automatic test equipment are presented. Probes in proposed MEMS devices fulfilled as ball grid arrays on flexible film with aluminum microwires. Such test fixtures give opportunity for self-monitoring contact of each probe to test point on board. The simplified devices can be used for BGA components testing before soldering in electronic modules.