Please use this identifier to cite or link to this item: http://openarchive.nure.ua/handle/document/3124
Title: MEMS Intellect Multiprobes Contacting Devices for Electrical Checking-up of Multilayers Commutative Boards and BGA/CSP Electronic Components
Authors: Nevliudov, I. Sh.
Palagin, V. A.
Razumov-Frizjuk, E. A.
Zharikova, I. V.
Keywords: Multilayer commutative boards
BGA/CSP components
electrical testing
test fixture
multiprobes contacting device
MEMS
Issue Date: 2012
Publisher: KHARKOV NATIONAL UNIVERSITY OF RADIOELECTRONICS
Citation: Nevliudov, I.Sh. MEMS Intellect Multiprobes Contacting Devices for Electrical Checking-up of Multilayers Commutative Boards and BGA/CSP Electronic Components [Text] / I. Sh. Nevliudov, V. A. Palagin, E. A. Razumov-Frizjuk, I. V. Zharikova // Proceedings of IEEE East-West Design & Test Symposium (EWDTS’2012), September 14-17, 2012, Kharkov, Ukraine. – РР. 483-485.
Abstract: The aim of this paper is to introduce a new method of multilayer commutative boards (printed, thick or thin film) and BGA components testing. Four types of test fixtures for connecting some thousands test points on unit under test to automatic test equipment are presented. Probes in proposed MEMS devices fulfilled as ball grid arrays on flexible film with aluminum microwires. Such test fixtures give opportunity for self-monitoring contact of each probe to test point on board. The simplified devices can be used for BGA components testing before soldering in electronic modules.
URI: http://openarchive.nure.ua/handle/document/3124
Appears in Collections:Наукові публікації

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