MEMS Intellect Multiprobes Contacting Devices for Electrical Checking-up of Multilayers Commutative Boards and BGA/CSP Electronic Components

Nevliudov, I. Sh.; Palagin, V. A.; Razumov-Frizjuk, E. A.; Zharikova, I. V.

Публікація:
MEMS Intellect Multiprobes Contacting Devices for Electrical Checking-up of Multilayers Commutative Boards and BGA/CSP Electronic Components

dc.contributor.author	Nevliudov, I. Sh.
dc.contributor.author	Palagin, V. A.
dc.contributor.author	Razumov-Frizjuk, E. A.
dc.contributor.author	Zharikova, I. V.
dc.date.accessioned	2016-10-03T10:49:10Z
dc.date.available	2016-10-03T10:49:10Z
dc.date.issued	2012
dc.description.abstract	The aim of this paper is to introduce a new method of multilayer commutative boards (printed, thick or thin film) and BGA components testing. Four types of test fixtures for connecting some thousands test points on unit under test to automatic test equipment are presented. Probes in proposed MEMS devices fulfilled as ball grid arrays on flexible film with aluminum microwires. Such test fixtures give opportunity for self-monitoring contact of each probe to test point on board. The simplified devices can be used for BGA components testing before soldering in electronic modules.	uk_UA
dc.identifier.citation	Nevliudov, I. Sh. MEMS Intellect Multiprobes Contacting Devices for Electrical Checking-up of Multilayers Commutative Boards and BGA/CSP Electronic Components [Text] / I. Sh. Nevliudov, V. A. Palagin, E. A. Razumov-Frizjuk, I. V. Zharikova // Proceedings of IEEE East-West Design & Test Symposium (EWDTS’2012), 14-17 sept., 2012. - Kharkov, Ukraine. – РР. 483-485.	uk_UA
dc.identifier.uri	http://openarchive.nure.ua/handle/document/3124
dc.language.iso	en	uk_UA
dc.publisher	KHARKOV NATIONAL UNIVERSITY OF RADIOELECTRONICS	uk_UA
dc.subject	Multilayer commutative boards	uk_UA
dc.subject	BGA/CSP components	uk_UA
dc.subject	electrical testing	uk_UA
dc.subject	test fixture	uk_UA
dc.subject	multiprobes contacting device	uk_UA
dc.subject	MEMS	uk_UA
dc.title	MEMS Intellect Multiprobes Contacting Devices for Electrical Checking-up of Multilayers Commutative Boards and BGA/CSP Electronic Components	uk_UA
dc.type	Conference proceedings	uk_UA
dspace.entity.type	Publication